DARPA Kicks Off JUMP 2.0 Consortium Aimed at Microelectronics Revolution

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Source: https://www.darpa.mil/DDM_Gallery/technology-network-619-a.jpg
Source: https://www.darpa.mil/DDM_Gallery/technology-network-619-a.jpg

January 24, 2023 | Originally published by Defense Advanced Research Projects Agency (DARPA) on January 4, 2023

DARPA, along with the Semiconductor Research Corporation (SRC) and industry and academic stakeholders, is kicking off the Joint University Microelectronics Program 2.0 (JUMP 2.0). The SRC-led effort expands on the original JUMP collaboration aimed at accelerating U.S. advances in information and communications technologies.

The consortium created under JUMP 2.0 will pursue high-risk, high-payoff research spanning seven thematically structured centers. Each multidisciplinary center will focus on one overarching research theme identified as key to addressing emerging technical challenges. These defined interests, spurred by an increasingly connected world and a rapidly changing microelectronics landscape, will centralize long-term, pathfinding research aimed at breakthroughs applicable across defense and academia.